JPS6175596A - スルホール多層回路基板の製造方法 - Google Patents
スルホール多層回路基板の製造方法Info
- Publication number
- JPS6175596A JPS6175596A JP59198162A JP19816284A JPS6175596A JP S6175596 A JPS6175596 A JP S6175596A JP 59198162 A JP59198162 A JP 59198162A JP 19816284 A JP19816284 A JP 19816284A JP S6175596 A JPS6175596 A JP S6175596A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- substrate
- hole
- holes
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims description 41
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 23
- 239000004065 semiconductor Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000003513 alkali Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- -1 circuit boards Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009331 sowing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59198162A JPS6175596A (ja) | 1984-09-20 | 1984-09-20 | スルホール多層回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59198162A JPS6175596A (ja) | 1984-09-20 | 1984-09-20 | スルホール多層回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6175596A true JPS6175596A (ja) | 1986-04-17 |
| JPH0438159B2 JPH0438159B2 (en]) | 1992-06-23 |
Family
ID=16386492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59198162A Granted JPS6175596A (ja) | 1984-09-20 | 1984-09-20 | スルホール多層回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6175596A (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6484698A (en) * | 1987-09-26 | 1989-03-29 | Matsushita Electric Works Ltd | Manufacture of multilayer circuit board |
| JP2002043454A (ja) * | 2000-07-24 | 2002-02-08 | Hitachi Chem Co Ltd | 半導体パッケージ用基板の製造方法とその方法を用いた半導体パッケージの製造方法及びこれらの方法を用いた半導体パッケージ用基板と半導体パッケージ |
| CN104819931A (zh) * | 2015-04-24 | 2015-08-05 | 深圳崇达多层线路板有限公司 | 一种电路板盲孔可靠性的检测方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50133465A (en]) * | 1974-04-15 | 1975-10-22 | ||
| JPS5445960A (en) * | 1977-09-16 | 1979-04-11 | Mitsubishi Electric Corp | Freezing/melting sludge treatment apparatus |
| JPS5731188A (en) * | 1980-07-31 | 1982-02-19 | Ibigawa Electric Ind Co Ltd | Method of producing printed circuit board |
-
1984
- 1984-09-20 JP JP59198162A patent/JPS6175596A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50133465A (en]) * | 1974-04-15 | 1975-10-22 | ||
| JPS5445960A (en) * | 1977-09-16 | 1979-04-11 | Mitsubishi Electric Corp | Freezing/melting sludge treatment apparatus |
| JPS5731188A (en) * | 1980-07-31 | 1982-02-19 | Ibigawa Electric Ind Co Ltd | Method of producing printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6484698A (en) * | 1987-09-26 | 1989-03-29 | Matsushita Electric Works Ltd | Manufacture of multilayer circuit board |
| JP2002043454A (ja) * | 2000-07-24 | 2002-02-08 | Hitachi Chem Co Ltd | 半導体パッケージ用基板の製造方法とその方法を用いた半導体パッケージの製造方法及びこれらの方法を用いた半導体パッケージ用基板と半導体パッケージ |
| CN104819931A (zh) * | 2015-04-24 | 2015-08-05 | 深圳崇达多层线路板有限公司 | 一种电路板盲孔可靠性的检测方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0438159B2 (en]) | 1992-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6555763B1 (en) | Multilayered circuit board for semiconductor chip module, and method of manufacturing the same | |
| JPH06291216A (ja) | 基板及びセラミックパッケージ | |
| KR100257926B1 (ko) | 회로기판형성용다층필름 및 이를 사용한 다층회로기판 및 반도체장치용패키지 | |
| JP2549393B2 (ja) | 回路基板の製造方法 | |
| JP3930222B2 (ja) | 半導体装置の製造方法 | |
| US8826531B1 (en) | Method for making an integrated circuit substrate having laminated laser-embedded circuit layers | |
| JP2004056115A (ja) | 多層配線基板 | |
| JPH05343856A (ja) | 多層プリント配線板およびその製造方法 | |
| JPS6175596A (ja) | スルホール多層回路基板の製造方法 | |
| JP2784524B2 (ja) | 多層電子部品搭載用基板及びその製造法 | |
| JP3330104B2 (ja) | 多数個取りセラミック配線基板の製造方法 | |
| JP2003229661A (ja) | 配線基板およびその製造方法 | |
| JP4193479B2 (ja) | 素子実装基板の製造方法 | |
| JPH02164096A (ja) | 多層電子回路基板とその製造方法 | |
| JP2004055985A (ja) | セラミックパッケージ及び電子装置 | |
| JPS6364079B2 (en]) | ||
| JPH03136396A (ja) | 電子回路部品とその製造方法及び電子回路装置 | |
| JPH0230199B2 (ja) | Fukugopurintohaisenbannoseizohoho | |
| JP2874734B2 (ja) | 高周波デバイス用多層配線基板 | |
| JP2000058995A (ja) | セラミック回路基板及び半導体モジュール | |
| JP4081718B2 (ja) | ブラインドビアを有する多層基板 | |
| JP2001291800A (ja) | 電子部品用パッケージ | |
| JPS6355236B2 (en]) | ||
| JP2004342930A (ja) | 非貫通導通穴を有する多層基板 | |
| JP2000012772A (ja) | 集積化半導体装置の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |